BGA STALLION 207

• High Performance and Easy Operation
  DIGITAL BGA Stallion 207 Rework Station equipped with outstanding Multifunction nozzles and precise temperature control device,with two hot air heater for uniform and controlled heating, Also will prcisely and accurately proceed BGA soldering and desoldering work.
• Durable Structure
  Main structure is a Metal Sheet alloy with heat treatment, Easy maintenance, durable utilization and beautiful appearance. The hot air nozzle can be rotated freely with a range of 360 Degree Totally ground wire design.
• Quick Soldering and Protect the Components Safety
  Hot air multi-hole round center support, especially useful for big-size PCB and BGA located in the center of PCB.
  
  Temperature profile of bottom hot air heater can reach as high as 300?, critical for big size motherboard. Meanwhile, it can setup with upper heater for synchronized work or independent operation.
  
  Specification:-
  1. Total Power: 2000W
  2. Top Heater: 1000W
  3. Bottom Heater: 1000W
  4. Power Supply: INPUT Single Phase 220-240V AC 50/60Htz, Out Put 2KW
  5. Machine Dimension: 19"H 13"W18"L
  6. Weight: 12Kg. Approx.
  7. Tempreature Control: High Precision J Sensor
  8. V Groove for PCB Poistioning

Specification:-

1. Total Power: 2000W
2. Top Heater: 1000W
3. Bottom Heater: 1000W
4. Power Supply: INPUT Single Phase 220-240V AC 50/60Htz, Out Put 2KW
5. Machine Dimension: 19"H 13"W18"L
6. Weight: 12Kg. Approx.
7. Tempreature Control: High Precision J Sensor
8. V Groove for PCB Poistioning

FEATURES:-

• High-Precision materials (Temperature Sensor, PLC, Heater) to control the BGA desoldering & soldering procedures precisely.
• One ceramic (Infra) heater on the the bottom & one hot air heater on the top for uniform and controlled heating.
• High –precision thermocouple to detect top/bottom temperature precisely.
• Top & Bottom temperature areas heat independently, and it can set up 5 rising temperature segments and 5 constant temperature segment to control.
• A vaccume suction pen to facilitate the removing of BGA after desoldering.
• The hot air nozzle can rotate 360Degree freely and its easy to replace.

SPECIFATIONS:-

1. Total Power : 4000W
2. Top Heater : 800W
3. Bottom Heater : 3200W
4. Power Supply: Single Phase 220VAC 50/60Hz 4KVA
5. Machine Dimension: 18"H16"W18"L
6. Temperature Control: High Precision K Sensor
7. Positioning : V-Groove for PCB Positioning
8. Max. PCB Size : 300mmX320mm
9. Weight : 15 Kg. Approx.

FEATURES:-

• High-Precision materials (Temperature Sensor, PLC, Heater) to control the BGA desoldering & soldering procedures precisely.
• Four ceramic (Infra) heater on the the bottom & one heater on the top for uniform and controlled heating.
• High –precision thermocouple to detect top/bottom temperature precisely.
• Top & Bottom temperature areas heat independently, and it can set up 5 rising temperature segments and 5 constant temperature segment to control.
• Top & Bottom heating can be controlled independently, a powerful cross-flow fan cools rapidly to protect the PCB from deformation when welding.
• A vaccume suction pen to facilitate the removing of BGA after desoldering. Large PCB can be handled easily.
• The hot air nozzle can rotate 360Degree freely and its easy to replace, Offering BGA nozzles of different sizes for you to replace easily.

• Micro Computer Control, Easy to operate on the platform, Similer to reflow oven, Multi Safety Protection.
• Heating Area: 112mmX200mm
• Power Consumption: 600W
• Power Supply: AC 220V
• Dimension: 310mmX280mmx145mm
• Weight : 7.5 KG Approx.

THIS BGA REWORKSTATION has been developed by the in house R&D team with the help and inputs from the service engineers who worked day in day out to come out with this kind of low cost machine. It is a rugged, sturdy machine with ease of operation. And affordable for those as well who wants to start their new venture.

This Machine is a big boon for people who are looking for a low cost profitable solution for the repair of laptop and desktop motherboards and are into BGA CHIP level of repair and were finding it difficult to have a costly machine which is still out of reach for many. With the help of this machine it's been easy to replace the BGA IC's and reballing of IC with complete accuracy. Which was not the case before. It's also a profitable proposition for the institutes who are into the training of hardware repair of laptops and desktops.

The cost benefit analysis below will prove that the investment can be easily recovered in a vary short duration of 2-3 months.

APPX. COST OF THE MACHINE WITH ACCESSORIES   -   75,000/-
Training will be given for 2-3 days at our Delhi office and after that the person is well equipped to use the machine to its full capacity.

(THE COMPANY HAS AN INSTALLED BASE OF OVER 200+ MACHINES AND THESE HAVE BEEN WORKING SUCCESSFULLY FOR OVER 2 YEARS. OUR SUPPORT CENTRE IS FULLY EQUIPPED WITH SPARES AND CONSUMABLES. )